Product Description:
Qualtech Products Industry Ball Punch Tester is an advanced Cupping Tester to perform a Ball Punch Test and Cupping Test to instantly determine the performance and crack resistance of paint and coatings.
This Semi-Automatic Cupping Tester measures the elongation and the deformation of paint and coatings applied onto a substrate.
The Cupping Test Method is often used in combination with the evaluation of the performance of protective coatings.
To perform a Cupping Test the coated sample is mounted into the sample holder. The maximum width of the sample can reach up to 90mm. The Ball Punch Test is completed automatically at the touch of a button.
The Cupping Test results are presented on the large Color Touchscreen Display and can be observed with the integrated Optical System or the large illuminated magnifying glass.
This professional Cupping Tester offers the newest microchip technology combined with a large LCD Display, semi-automatic sample test, continuously programmable Punch Distance, integrated high precision sensors with an accuracy of ±0.01mm, high punch speed accuracy, integrated illuminated Magnifying Glass, user-friendly application, user-friendly sample handling, high accuracy and high precision, ergonomic design, reliable performance and longevity.
This professional Automatic Cupping Tester is designed and engineered in accordance with international test standards including:
Ball Punch Tester - Features:
- Newest Technology
- Semi-Automatic Cupping Test
- Large LCD Display
- Integrated illuminated Magnifying Glass
- Electronic Sample Evaluation & Visual Sample Evaluation
- High-Precision Electronic Ball Punch Positioning System
- High-Precision Sensors with an accuracy of ±0.01 mm
- Integrated Memory
- Easy Sample Mount
- User-friendly Application
- User-friendly Sample Handling
- High Accuracy & High Precision
- Ergonomic Design
- Reliable Performance & Longevity
- Engineered in accordance with international test standards including ASTM E643, ISO 1529, BS 3900 E4
Cupping Tester – Specifications:
| Model | QPI-BPT3800 |
|---|---|
| Newest Microchip Technology | Yes |
| Large LCD Display | Yes |
| Semi-Automatic Ball Punch Deformation Test | Yes |
| Integrated illuminated Magnifying Glass | Yes |
| Sample Evaluation | Electronic Sample Evaluation Visual Sample Evaluation |
| Ball Punch Diameter | 20 mm, 0.8" |
| Measuring Range | 0.00 mm - 18.00 mm |
| Accuracy | ±0.01 mm |
| Maximum Force | 2500 N |
| High-Precision Electronic Ball Punch Positioning System | Yes |
| Sample Thickness | 0.03 mm - 1.25 mm |
| Maximum Sample Width | 70 mm |
| High-Precision Sensors | Yes |
| Integrated Memory | Yes |
| Easy Sample Mount | Yes |
| User-friendly Menu Navigation | Yes |
| User-friendly Application | Yes |
| User-friendly Sample Handling | Yes |
| Automatic Calibration | Yes |
| High Accuracy & High Precision | Yes |
| Ergonomic Design | Yes |
| Reliable Performance & Longevity | Yes |
| Voltage | 110 Volts 60Hz & 220 Volts 50Hz |
| Engineered in accordance with international test standards including ASTM D5440, ASTM D7138 |
|
Cupping Tester – Included items:
- Semi-Automatic Cupping Tester
- Accessories
- Quality Certificate
- Carefully Calibrated
- Calibration Certificate
- User manual
- Extended Warranty
- Lifetime Support
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