Disgrifiad o'r cynnyrch:
Diwydiant Cynhyrchion Qualtech Gorchuddwr sbin yn weithiwr proffesiynol Polymer Film Application Equipment to apply a uniform thin film or ultra-thin polymer film on sample surfaces and substrates including wafers.
Spin Coating is the application of a small amount of liquid sample at the center of the sample or substrate, e.g. wafer. Initially when adding the liquid sample the wafer is usually not in motion or it is spinning at a very low speed. After the liquid sample has been added on the wafer the spinning speed increases to a very high level to help spread the liquid sample automatically from the center of the wafer across the whole surface of the wafer to create a uniform coating.
The thickness of the applied coating is dependent on a variety of factors including:
- the viscosity of the liquid sample,
- the concentration of the liquid sample,
- the spinning speed of the wafer.
This professional Spin Coater is designed and engineered offering the newest microchip technology combined with a large Touchscreen Display with Backlight, a High-Precision Vacuum System, a precision High Performance Motor, High Speed Acceleration, Continuous Speed Control, advanced Precision Sensors, integrated Safety Features, Fully Automatic Program Controlled with user-friendly programming, user-friendly Sample Handling, a Continuous Speed Control, high accuracy and high precision, an ergonomic design, reliable performance, longevity and much more.
Y datblygedig hwn Spin Coating Equipment is recommended for a wide range of substrates including silicon wafers, ceramic wafers, glass panels and related substrates and it is widely used to create thin films and ultrathin films within the Nanoscale Thickness including photolithography.
This professional Spin Coater is designed and engineered in accordance with international test standards.
Spin Coater – Features:
- Advanced Spin Coating Equipment
- Automatic Uniform High-Precision Thinfilm Application
- Large Touchscreen Display with Backlight
- High Speed Acceleration
- Rheolaeth Cyflymder Ddi-dor
- Fully Automatic Program Controlled
- High-Precision Vacuum System
- Rhaglennu hawdd ei ddefnyddio
- Cais hawdd ei ddefnyddio
- Easy Clean System
- Nodweddion Diogelwch Integredig
- Cywirdeb Uchel a Manwl-gywirdeb Uchel
- Dyluniad Ergonomig
- Perfformiad Dibynadwy a Hirhoedledd
- Peirianyddwyd yn unol â safonau profi rhyngwladol
Advanced Spin Coating Equipment – Manylebau:
| Model | QPI-SPC2800 | QPI-SPC6800 |
|---|---|---|
| Advanced Spin Coating | Ie | Ie |
| Technoleg Micro-sglodyn ddiweddaraf | Ie | Ie |
| Arddangosfa Sgrin Gyffwrdd Lliw Fawr gyda Chefn-oleuadau | Ie | Ie |
| Advanced Vacuum System | Ie | Ie |
| Spinning Speed Range | 10 RPM - 10000 RPM | 10 RPM - 20000 RPM |
| Cydraniad y sgrin | 1 RPM | 1 RPM |
| Speed Accuracy | <0.02% | <0.02% |
| Spin Acceleration | Up to 20000 RPM/s | Up to 20000 RPM/s |
| Time Display Resolution | 0.1 s | 0.1 s |
| Acceleration Time Range | 0-999.9 s | 0-999.9 s |
| Spin Coating Time Range | 1 - 9999.9 s | 1 - 9999.9 s |
| Vacuum Preparation Time | 99 s | 99 s |
| Vacuum Release Time | 99 s | 99 s |
| Wafer Size | 10 mm - 100 mm | 10 mm - 100 mm |
| Advanced Vacuum Wafer Holder | Ie | Ie |
| Cais hawdd ei ddefnyddio | Ie | Ie |
| Increased Safety | Ie | Ie |
| Cywirdeb Uchel a Manwl-gywirdeb Uchel | Ie | Ie |
| Dyluniad Ergonomig | Ie | Ie |
| Reliable Performance & Longevity | Ie | Ie |
| Peirianyddwyd yn unol â safonau profi rhyngwladol | Ie | Ie |
Advanced Spin Coater – Eitemau wedi'u cynnwys:
- Professional Spin Coating Equipment
- Tystysgrif Ansawdd
- Graddnodedig yn ofalus
- Tystysgrif Graddnodi
- Llawlyfr defnyddiwr
- Gwarant estynedig
- Cymorth am oes
Cewch wybodaeth nawr am gynhyrchion, prisiau, cymorth technegol a gwasanaethau proffesiynol.
Bydd un o'n harbenigwyr yn ateb eich ymholiad cyn bo hir. Fel arall, cysylltwch â ni drwy fanylion y cwmni yn yr Unol Daleithiau, yn Awstralia neu yn y DU.







































